Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

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Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Bonding of high purity polished copper was investigated using the Spark Plasma Sintering technique (SPS) showing the effect of SPS parameters (surface roughness, time, temperature and pressure) on the bonding strength behaviour. Mechanical characterization of the bonded samples was performed at room temperature using tensile test. Two surfaces roughnesses were studied (un-polished and polished ...

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Low temperature spark plasma sintering of YIG powders Authors: L. Fernandez-Garcia

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ژورنال

عنوان ژورنال: Advanced Materials Research

سال: 2011

ISSN: 1662-8985

DOI: 10.4028/www.scientific.net/amr.324.177